Production Capabilities
Advanced equipment and experienced technicians delivering precision electronics manufacturing.
Surface Mount Technology (SMT)
Our SMT production line features Mydata surface mount equipment with vision-assisted component placement, capable of handling passive components down to 0402 size and BGA packages with 1,100+ pin counts. We process pitch sizes down to 12 mil, covering the full range of modern surface mount requirements.
Our SMT line supports both lead-free and leaded soldering processes, with separate profiles and procedures to prevent contamination between process types.
Through-Hole & Manual Assembly
For through-hole components and labor-intensive assemblies, our experienced technicians provide precision manual insertion, soldering, and inspection. We specialize in high-reliability manual work for applications where automated processes are not suitable.
Our through-hole capabilities include selective soldering, wave soldering, and hand soldering for complex assemblies requiring specialized techniques.
Inspection & Testing
Quality starts with inspection. Our facility is equipped with Automated Optical Inspection (AOI) systems, X-ray inspection for BGA and hidden solder joints, and comprehensive functional testing capabilities including RF testing.
We develop custom test fixtures and procedures for each product, ensuring that every unit leaving our facility meets your exact specifications.
